SY-AC1000 is used in the post-chemical polishing process of wafers containing anti-corrosion agents 
		and tungsten, is alkaline with negative embellishment potential to prevent oxidation and corrosion of tungsten, 
		and improves defects in the post-process without etching metals, leaving deposits or contaminating wafers.
       
        
          
          
           
            | Appearance | amber transparent liquid | 
           
            | pH(25℃) | 4.0~5.5 | 
		    
            | Density(25℃, g/㎤) | 1.20±0.05(25℃) | 
        
        
        
        
        Product characteristics
         - SY-AC1000 effectively disables heavy metal ions 
          such as Fe, Cu and Ni, as well as Ca, in a wide pH range, to prevent 
          problems caused by metal ions contained in water.
          - Almost all metal ions, including Cu and Ni, and stable kilolites are 
          formed to separate and remove most metal ions.
          - The ability to form metals and flammable compounds is excellent, reducing 
          the amount of metal that penetrates into semiconductor wafers.
          - Metal salts and strong dispersion effects effectively remove impurities 
          from pretreatment without leaving any contaminants to prevent reattachment.
          - As a scale inhibitor, it combines with ions from Fe, Mg, Ca, and other 
          metals to enhance the cleaning effect.
        
        Purpose
        
        
        Packing
         - 1000kg IBC Tank, 200kg PE Drum